Layout Guidelines¶

Land pattern¶

The five 1mm pads in the square GND pad cutout can be omitted.

Solder Mask¶

The ground pad solder mask on the bottom side of the QS module is divided into sections.

GND Vias¶

If the via holes used on the application board have a diameter larger than 0.3 mm, it is recommended to mask the via holes to prevent solder wicking through the via holes. Solders have a habit of filling holes and leaving voids in the thermal pad solder junction, as well as forming solder balls on the other side of the application board which can in some cases be problematic. The 0.7mm wide solder mask stripes can be used to arrange the vias.

Future-proof Land Pattern¶

Future versions of QS modules like the QS95 can be double-sided. To accommodate this, a cut-out must be provided on the baseboard. The version with the cut-out remains fully compatible with the current design while being prepared for future versions.

QS2 Land Pattern — 108 pin QS95 Land Pattern¶

Future-proof Solder Mask¶