Concept

The QSCOM series is a QFN style solder-down Computer on Module. It integrates all the core components such as processor, memory and power supply on a small square size of 27mm at a maximum overall mounting height of 2.3mm, soldered onto an application specific carrier board. Its QFN type lead style has a 1mm pitch with 100 I/O pads assigned in the QS standard. The central ground pad additionally acts as thermal pad.