Handling and Storage Guidelines

Transport and Delivery Condition

The undersides of our QS modules feature Electroless Nickel Immersion Gold (ENIG) surface finishes designed for subsequent soldering onto the host PCB. To ensure optimal solderability and to prevent moisture-induced damage, the modules are shipped in a pre-dried state, vacuum-sealed in a Moisture Barrier Bag (MBB) complete with a Humidity Indicator Card (HIC) and desiccant.

Processing After Opening

The modules are classified as Moisture Sensitivity Level MSL 3 in accordance with IPC/JEDEC J-STD-020. Floor Life: Once the vacuum-sealed protective bag is opened, the maximum allowable processing time (floor life) is 167 hours under ambient conditions of < 30°C / 60 % RH. Exceeding Floor Life: If this processing time is exceeded without the modules being soldered, a mandatory re-baking process (thermal drying) must be performed prior to soldering to prevent delamination or damage caused by the “popcorn effect” during reflow soldering (72 hours at 80°C +/- 5°C).

Recommended Storage Conditions and Overall Shelf Life

Long-Term Storage Specification: Modules must always be stored in their dry, vacuum-sealed Moisture Barrier Bags (MBB). Storage must be maintained at room temperature (15-25°C) and a relative humidity of < 50% (ideally 30-40%). Shelf Life: Subject to compliance with the optimal storage conditions specified above, it is recommended to process the modules within 12 to 24 months.

Technical Note: Exceeding the shelf life primarily leads to degraded solderability of the ENIG pads due to solid-state diffusion processes (nickel diffusion to the gold surface), which can adversely affect the soldering results on the host board. Should process deviations or quality issues occur during soldering after the shelf life has expired, the properties of the solder paste and flux being used must be verified (flux classification according to IPC J-STD-004), and the materials and process parameters must be adjusted as necessary.